2025.08.22 CPO Packaging Technology

CPO (Co-Packaged Optics) packaging technology requires ultra-high precision bonding, mainly because it tightly integrates optical components (such as optical transceivers) with high-speed electronic devices (such as switching chips) within the same package. This design imposes extremely high requirements on alignment accuracy, thermal management, and signal integrity.

Even the slightest misalignment can cause significant optical loss, thereby reducing overall transmission efficiency or causing functional failure.

CPO supports 400G / 800G and even higher bandwidth transmissions, which means signal paths must be extremely short with minimal distortion. If bonding accuracy is insufficient, it can lead to uneven contact impedance or inconsistent path lengths, resulting in:

• Higher bit error rates (BER)

• Increased EMI and aggravated jitter

At the same time, CPO packaging involves high density and high power, requiring an effective thermal management system. High-precision bonding ensures tight adhesion of thermal structures, reducing thermal resistance and preventing overheating of optoelectronic components or chips.

CPO often involves complex assembly of optical components + electronic ICs + passive optical modules (such as waveguides and microlenses). Since each material has different coefficients of thermal expansion, more precise bonding is required to prevent deformation and stress-related damage.

TRESKY systems employ a granite platform combined with state-of-the-art real-time controllers to ensure fast positioning of multi-axis systems. With highly accurate vision systems and active alignment control, they deliver sub-micron bonding precision.

#CPOPackaging
#HighPrecisionBondingMachine
#ActiveAlignment
#ActiveBonding
#Photonics
#<1umAlignmentAccuracy
#Ficontec