Products

  • TRESKY
  • Bonding machine
  • Model
    T-6000
  • Feature
    • Mounting accuracy ±2.5 μm (3 sigma)
    • Compatible with Wafer, Waffle pack, Tray, SMD reel multi-style feeding
    • Compatible with different media processes of Paste, Preform, DAF
    • Friendly and easy software interface, convenient and fast programming
    • Single machine multi-function requirements
    • Optional conveyor belt module
    • Complete automatic process
    • Fully automated die bonder
  • TRESKY AG
  • Bonding machine 
  • Model
    T-3002-PRO
  • Feature
    • High accuracy <5 μm
    • Vertical Z axis placement mode
    • 360 degree rotation
    • Diversified supply requirements (Wafer, Waffle pack, Tray, SMD reel...)
    • Programmable module settings
    • Optional heating plate and profile automatic control
    • Flip-Chip Bonding
    • Eutectic Patch
    • Adhesive solid crystal
    • Ultrasonic bonding
    • Thermosonic bonding
    • Chip stacking
  • F&S
  • Wire bonding machine 
  • Model
    5600 Series
  • Feature
    • Wire bonding, pull wire test
    • The best choice for experiment, test and repair
    • Manual and automatic mode correspondence
    • Modular design, single machine can correspond to different    needs such as Ball, Wedge, etc.
    • Corresponding to gold wire, copper wire, aluminum wire and aluminum strip
    • Optional tension module to directly measure line tension
  • F&K
  • Wire bonding machine 
  • Model
    Model D
  • Feature
    • Ultrasonic&Laser Wire Bonding Machine
    • Metal strip wire machine
    • IGBT module
    • High power Module
    • Automotive electronics
  • Nanotest
  • Fault analysis system
  • Model
    TIFAS IR
  • Feature
    • Infrared image acquisition
    • Thermal signal reconstruction
    • Multiple algorithms
    • Automated analysis
    • Synchronous flash excitation
    • Not system-specific
    • Plug and play
  • Nanotest
  • Thermal interface material analyzer
  • Model
    TIMA 5
  • Feature
    • Suitable for various materials and anisotropic composite materials.
    • Compliant with ASTM D5470 standard.
    • ±300 N clamping and tensile force
    • Fully automated measurement
    • Boundary condition analysis
    • Extreme condition testing
    • Overall thermal resistance and bulk material thermal conductivity
  • Nanotest
  • 3Ω characteristics system
  • Model
    TOCS
  • Feature
    • Reusable test chips
    • Compatible with any 3Ω measurement structure.
    • Desktop system
    • Liquids and suspensions
    • Gels, pastes, and fillers
  • Plasma Parylene Systems GmbH
  • plasma systems
  • Feature
    • Cleaning and activation of surfaces
    • Reduction of oxides on metallic surfaces
    • Removal of photoresists in semiconductor technology
    • Ashing of organic substances such as photoresists
    • Removal of SU – 8 varnishes and sacrificial layers
    • Cleaning and etching of solar cells, PCBs, kapton films (roll to roll)
    • Etching of multi-layer PCBs.
    • Plasma process before bonding and potting, BGAs, Flip Chip, Chip
    • on Board technology
    • Customised polymer layers
    • Plasma frontend/backend applications
  • PYC
  • HotBar system
  • Model
    M4
  • Feature
    • Self-developed pulse system
    • Two different pressure values can be set in the production program
    • The multi-range temperature can be set in the production program
    • Equipment with multiple pressure heads has stable pressure control
    • Solder bonding, ACF bonding
    • Semi-automatic/fully automatic
  • UIC
  • High Speed Wafer Feeder
  • Model
    HSWF+FuzionSC
  • Feature
    • High accuracy: ( 10µm, < 3µm placement repeatability)
    • Dual or single beam, multiple spindle heads
    • Full range of die and component types and sizes
    • Versatile substrate handling
    • Broadest range of feeding platforms
    • Low maintenance, accurate over time
    • Vision robustness recognition of pins or logic pads
    • Stacking support ( PoP ): pre and post placement fiducials and Z zones
    • Low force capability

Gloves

  • 01Latex gloves
  • Size/Color
    9＂&12＂ White
  • Feature
    • Lenth : 290 +- 10mm
    • Color : nature / blue
    • Weight and Thickness
    • Nature color : 7.0g / 8.0g / 9.0g
    • High Risk Blue : 10mil
    • Surface : Full textured / Smooth
    • Size : Small / Medium / Large / X-large
    • ASTM - D3578 and EN455-1/2
  • 02NBR gloves
  • Size/Color
    9＂&12＂ Blue Purple
  • Feature
    • Lenth : 290 +- 10mm
    • Color : white / blue
    • Surface : Finger textured
    • Size : Xsmall / Small / Medium / Large / X-large
    • ASTM D6319 and EN455-1/2
    • ISO 13485, ISO 9001
  • 03PVC gloves
  • Size/Color
    9＂&12＂ Transparent color
  • Feature
    • Color : Clear
    • Weight : 9"( 5.0g ~ 6.0g ) / 12"(6.8g )
    • Surface : Smooth
    • Size : Xsmall / Small / Medium / Large / X-large
    • ISO 13485, ISO 9001