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2022.08.15 Wire Bonding application in Quantum PC development

Wire Bonding application in Quantum PC development

Highly precised semi-automatic desktop wire bonder - F&S 5632i 

Quantum computers are based on qubit chips, with the technology of packaging and stacking chips, allowing qubits to perform quantum computing at high densities.

Taiwan has advantages in semiconductors. It develops the ability to manufacture high-end quantum computer components and design and manufacture peripheral key equipment. In response to the trend of ultra-large quantum computers, it can improve the capacity of core components and key equipment.

 
 

While forming the national team, we also contributed our own efforts to use the F&S aluminum wire bonding machine to complete the wire bonding operation of aluminum wire and Ribbon on the surface formed by aluminum/alumina/aluminum and the substrate made of silicon or sapphire.

Thank you national research institute for choosing Bondtronics.

#qubit chips 

#JosephsonEffect 

#AluminumWire 

#WedgeBonding 

#Wire & Ribbon 

#R&D bonder