NEWS

2023.04.24 TRESKY Power Module Bonding

Due to the rapid rise of applications such as electric vehicles & gasoline-electric hybrid vehicles (new energy vehicles), fast charging, and wireless charging, the demand boom is expected in the next few years 

Although Taiwan has not been deeply involved in power devices (Power module) in the past few years, with Taiwan's strong semiconductor supply chain and the ability of Taiwanese businessmen to quickly copy, I believe that there is still a chance to occupy a place in the emerging market in the future 

However, automotive electronics are related to safety, and the product verification period is very long. If the timeliness is affected by the long delivery period of the equipment supplier, it may be too late for subsequent attacks. 

TRESKY has cooperated with many automotive brands in Europe, America and mainland China to provide reasonable equipment delivery and flexible production capacity, whether it is Sinter paste or Preform.

#IGBT module  

 #MOSFET  

 #Sintering  

 #DIE bonder  

 #Multi-function 

 #SiC wafer