In order to provide customized and complete services to customers from all over the world, one local manufacturer,established for 30 years has chosen the high-precision desktop die-bonding machine T-5300W from Switzerland.
From circuit layout, surface mount technology SMT (Surface Mount Technology), COB (Chip On Board), surrounding resin coating (Conformal Coating)...etc. Applications include: automotive electronics, optical communications, industrial electronic equipment, medical electronic equipment, military and aerospace electronics
Complete product packaging and functional testing, providing customers with one-stop process solutions Whether it is DIE bond, Flip chip, Eutectic, Ultrasonic, COB or COG, it can be processed