We have been deeply committed to the advanced process technology sector for many years.
从R&D Labs and Pilot to Small–Medium Production Lines
TRESKY AG TRESKY AG tabletop die bonders are renowned for their precision exceptional process flexibility
Your best partner for chip bonding processes, whether for…
#Silver Epoxy
#UV Adhesive
#Epoxy Process
# Flip Chip
#Eutectic
#Sintering
#Thermo-Compression Bonding (TCB)
Supporting a wide range of processes—whether you are working on chip-on-substrate, chip-on-wafer, or CPO packaging, we are fully capable of meeting your diverse production requirements.