“Driven by high-speed computing and high power density in AI/HPC chips,thermal management has become a critical bottleneck affecting performance and reliability.

  Small differences in TIM materials can be magnified into major gaps in AI system performance, lifespan, and stability.

  The Nanotest TIM measurement system helps R&D teams simulate real contact pressure and temperature conditions in AI accelerators, GPUs, HBM, and chiplet packaging, enabling precise evaluation of TIM performance under high heat flux.

We sincerely thank the Southern Key Semiconductor Institute of Materials for introducing the TIMA-5 measurement system to accurately characterize the thermal performance of paste, adhesive, film, pad, and solid material samples.

By providing highly reproducible thermal resistance data, the system enables informed thermal material selection and the establishment of a TIM material parameter database for formulation optimization and performance prediction, in partnership with Bondtronics.