The Key to AI Thermal Management Is More Than Thermal Conductivity

As AI Servers, GPUs, HBM, CoWoS, and advanced packaging technologies continue to evolve, thermal material evaluation is shifting from Thermal Conductivity to true Thermal Performance.

With the rapid advancement of AI Servers, GPUs, HBM, CoWoS, and advanced packaging, thermal challenges are no longer determined solely by a material's Thermal Conductivity.

What truly matters today is:

• Real Interface Thermal Resistance
• Thermal Performance Under Applied Pressure
• Actual Performance of Ultra-Thin TIMs
• Package Interface Reliability
• Heat Accumulation in High-Power Devices

Conventional thermal conductivity data alone can no longer fully represent the actual thermal performance of materials used in AI applications.

Next-Generation Thermal Material Evaluation for AI Applications

It's Not Just About Measuring Thermal Conductivity

It's About Measuring Real Thermal Performance

TIMA 5 vs. Traditional Thermal Conductivity Measurement Methods

TIMA 5 simultaneously measures Bulk Thermal Conductivity and Interface Resistance, providing results that better reflect real-world TIM applications.

Designed Specifically for AI and Semiconductor TIM Materials

• Based on ASTM D5470 Standard Test Method
• Direct Measurement of Interface Resistance
• Simultaneous Measurement of Thermal Conductivity and Thermal Resistance
• Pressure-Controlled Testing for Real Application Conditions
• Suitable for TIM Grease, Gap Fillers, Gels, Pads, and Films
• Replicates Real Thermal Interfaces in AI and Advanced Packaging Applications

Still Using Hot Disk or Laser Flash?

As AI chip power consumption continues to increase, Thermal Conductivity alone is no longer sufficient to evaluate a material's thermal capability. TIMA 5 helps you measure what truly matters — real Thermal Performance.