Precision Die Bonding for Advanced Packaging — Without Space Constraints

The TRESKY T-200 tabletop automated die bonder
is designed for R&D, process development, and advanced packaging validation.

As Advanced Packaging technologies continue to evolve, Die Bonding has transformed from a traditional backend assembly process into a critical technology that directly impacts yield, thermal management, and electrical performance.

Driven by the rapid growth of Chiplet, 2.5D / 3D IC, SiP, and AI high-performance computing packaging, demand for highly accurate, stable, and automated die bonding equipment continues to increase.

Understanding the challenges faced by R&D teams and laboratories—including limited budgets and restricted workspace— TRESKY developed the T-200 , a tabletop high-precision automated engineering platform that delivers professional-grade die bonding capabilities within a compact footprint.

Whether for Eutectic Bonding, Adhesive Bonding, Chip-on-Wafer, or Thermo Compression Bonding (TCB), the T-200 provides the flexibility and precision required to support process validation, material development, and prototype production.