F&K Physiktechnik

Ultrasonic Transducer for all bonding technologies

Optimally adapted ultrasonic frequencies and powers for all bonding technologies (also for transducers from other manufacturers)

Worldwide unique measurement system to determine the electrical properties of every ultrasonic transducer

Standard tool for checking the production equipment

Determine the vibration amplitude and frequency of the bonding tool by non-contact measurement

Vibration amplitude based calibration of the bonding machine for perfect machine matching

Ideal extension to the Transducer Test System

Static and dynamic bond force measurements

Communication interface to F&K Delvotec wire bonders for automatic bond force calibration

Your service provider with many years of expertise in ultrasound in wire and die bonding

Experience in the development and production of digital ultrasound systems for chip interconnection since 1996