Wire Bonder

GOLD BALL

>> Gold wire 12,5 to 50 µm  
>> for currents in mA range  
>> 1st bond ball-shaped, 2nd bond fishtail 
>> Loop of any shape  
>> heated package (over 150°C) 
>> Robust, widely used, corrosion resistant
 

Heavy-Wire-Wedge

>> for power devices, currents up to 50 A

>> Wedge bonding with cutter after 2nd bond
>> very robust process, extremely popular 
>> Aluminium wire of 100 to 500 µm >> CU Wire of 100 – 300 µm

 

Heavy-Ribbon

>> Heavy Aluminium Ribbon up to 2000 x 300 µm cross section for even higher currents. 
 >> The bond head is a stronger version of the heavy wire bondhead.