F&S Multi Wire Bonder

Multifunctional wire bonder

Wire bonding made much simpler than you think
Wire bonding Just 5 mins. You can finish 1st Bond、Loop、2nd Bond、Termaintion
 

0.5 Mil 

Gold wire 

Bonding

 

Gold wire of 12.5µm(0.5mil) is currently known as the thinnest wire, suitable for precise and intricate packaging testing applications.

It’ no problem for F&S wire bonder to suit for 0.5 mil applications.

 

Various Bond head assemblies for different wire diameters

 

10i

Gold Ball Bonding

12 to 50µm

30i/32i

Wedge-Wedge Bonding 

12 to 75µm

50i/50HR

Heavy Wire Bonding 

100 to 500µm wire

2000 x 300µm Ribbon

 

5600i

Tensile and pull force testing head assembly

BAMFIT

  Reliability testing head assembly for thick wires.

 F&S BONDTEC wire bonder offers the best quality and unparalleled cost-effectiveness. The key feature of all series of wire bonders is the ability to quickly and easily replace the bonding head (BondHead), corresponding to and meeting all necessary wire bonding requirements.

Equally important is the intuitive software interface, which optimally supports the wire bonding process, thereby achieving the best results.