Bonding Material

 

Metal wires ( Including gold wires, aluminum wires, alloy wires, and so on.
Providing various types of wires to meet your diverse applications.

Gold Ball 12.5 to 50 µm

Basic wire bonding applications

Thin-Wire-Wedge 17 to 75 µm

mA applications within the current range

Gold or Aluminum ribbon - 12 x 75 µm

Gold, aluminum strips, battery module applications

Heavy-Wire-Wedge - 100 to 500 µm

Corresponding to high-power, high-current applications (ex: IGBT)

 

Adhesive materials
Preformed solder preforms (Solder Preform)

Au/Sn Alloy in Wafflepack

Au/Sn Alloy in reel