Tresky Sinter Bonder

Sinter Bonder

Designed specifically for high-power electrical modules.

 
  • IGBT Sintering
  • Direct Bond Copper (DBC) sintering
  • T-Pak sintering
  • Die Transfer Film (DTF) process
  • Active Metal Bonding (AMB)
  • Silver paste/copper paste narrow gap dispensing
  • Positioning adhesive dispensing
  • Preform tin sheet feeding
  • Conveyor belt/caterpillar
  • Compatible with 12" Wafer
  • Inline vacuum bonding process can be accommodated

Sintering technology for automotive and power modules

High-performance semiconductor packaging is a critical component for energy transition and electric vehicles. To address this, Tresky has developed sintering processes, and these pre-sintering processes can be utilized in all of Tresky's die bonding machines.

Power module application examples

 

Tresky's narrow-gap nozzles uniformly apply copper paste/silver paste

Optional positioning adhesives can be used to position chips on the adhesive awaiting sintering

T-Pak bonds through copper paste

T-PakBonding is completed on the power substrate.