Tresky AG Desktop Bonder

 

 

  • ±1µm high accuracy
  • Wide range of force (up to 50kgf)， Meets R&D testing requirements
  • Modular design for multifunctionality in a single device

Dynamic heating

Programmable heating from above and below

Dispensing in one go

Simultaneous pick-and-place of die completes the gluing step

T-5100-W (NEW)

 

Wafer feeding upgrade version (including top-view camera module)

T-5300 (NEW)

Die bonder & Component placement machine

T-5300 continues the functions of the T-5100 and further evolves  

  • Z-axis upgraded with full computerized automation control ~
  • Integration of touch screen and display screen
  • Increased bonding force from 1,000 g to 4,000 g
  • Option available for wafer feeding version - T-5300-W