• Accuracy± 2.5
• Versatile feeding, Corresponding Wafer, Waffle pack, Tray, SMT reel
• Corresponding Paste, Preform, DAF different media processes  
• User-friendly software interface, 15 minutes for completing automation program   
• Conveyor system, front-to-end processes completed, Fully automated process

• Applications of various die attach adhesives
• Crawling and overflow control
• Tresky Bonder is your indispensable and optimal testing partner

• Convenient Bulk material feeding syestm
• Let the machine handle complex tasks for you automatically.
• Facilitating a simple and easy completion of the manufacturing process for you.

Flip-chip Die bonding

• Precision top-view camera
• make sure the correct position of Bump
• Stable suction and placement.
• Feeding and flipping from the wafer.